| Board Thickness | 0.1-0.5 mm |
| Copper Thickness | 0.5 oz, 1.0 oz |
| Soldermask | Green/Black/White/Red/Blue/Yellow |
| Surface finishing | Immersion Gold, Immersion Silver, Gold Finger, Immersion Tin, HASL, OSP |
| Max Panel size | 600*500mm |
| Special Technology | Blind buried via, Plate hole, Impedance control, BGA, Back Drill |