Board Thickness | 0.1-0.5 mm |
Copper Thickness | 0.5 oz, 1.0 oz |
Soldermask | Green/Black/White/Red/Blue/Yellow |
Surface finishing | Immersion Gold, Immersion Silver, Gold Finger, Immersion Tin, HASL, OSP |
Max Panel size | 600*500mm |
Special Technology | Blind buried via, Plate hole, Impedance control, BGA, Back Drill |