| Supported Capabilities | |
| Type of assembly |
THD (Thru-hole device) / Conventional
SMT (Surface-mount technology) SMT & THD mixed
Double-sided SMT and/or THD assembly
|
| Order quantity | Prototype to mass production |
| Components |
Passives, smallest size 0201
Fine pitch to 08 Mils
Leadless chip carriers/ BGA, VFBGA, FPGA & DFN
Connectors and terminals
|
| Component packaging |
Reels
Cut tape
Tube
Loose parts
|
| Board dimensions |
Smallest size: 0.25” x 0.25”, 6mm x 6mm
Largest size: 15.75″ x 13.5″, 400mm x 340mm
|
| Board shape |
Rectangular
Round, Slots, Cutouts, Complex, Irregular |
| Solder Type |
Rigid
Flexible
Rigid-flexible
|
| Solder Type |
Leaded and Lead-Free
Water soluble solder paste
Manual soldering for special parts, e.g. wires and temperature sensitive parts.
|
| Design file format |
Gerber RS-274X, 274D, Eagle and AutoCAD’s DXF, DWG
BOM (Bill of Materials) Pick and Place file (XYRS)
|
We perform multiple quality assurance procedures before shipping out any board. These include:
· Visual inspection,
· X-ray Inspection,
· AOI (Automated Optical Inspector),
· Functional test (test modules need to be supplied) .
